Röntgen incelemesiSeamark X-ray machine
5600
Röntgen incelemesi
Seamark X-ray machine
5600
Üretim yılı
2026
Durumu
Yeni
Konum
Veenendaal 

Resimleri göster
Haritayı göster
Makineye ait bilgiler
- Makine tanımı:
- Röntgen incelemesi
- Makine üreticisi:
- Seamark X-ray machine
- Model:
- 5600
- Üretim yılı:
- 2026
- Durumu:
- yeni
Fiyat ve Konum
- Konum:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

Ara
Teklif detayları
- Listeleme kimliği:
- A213-03637
- Son güncelleme tarihi:
- 23.02.2026
Açıklama
Model: X5600
Application: Micro-focus X-ray inspection of electronic components and assemblies such as BGA, CSP, SMT, wafer, SOP, QFN, sensors, and more.
X-ray Source
Specification Value
Type Sealed micro-focus X-ray tube
Voltage 40–90 kV
Current 10–200 µA
Max. output power 8 W
Microfocus spot size 15 µm
X-ray leakage ≤ 0.5–≤ 1 μSv/h (safety standard)
Detector & Image Quality
Specification Value
Detector type TFT industrial dynamic flat panel detector
Resolution pixel matrix 768 × 768 (occasionally 1.3 M pixel report depending on configuration)
Field of View (FOV) 65 × 65 mm to ~130 × 130 mm
Image resolution ~5.8 Lp/mm
Frame rate ~20–40 fps
A/D conversion 16 bits
🛠️ Mechanical & System Specifications
Property Value
Machine dimensions Approx. L850 × W1000 × H1700 mm
Max. sample/size ~280 × 320 mm
Net weight Approx. 750 kg
Power supply 220 V 10 A / 110 V 15 A 50–60 Hz
Operating system Industrial PC (Windows 7/10 64-bit)
Inspection mode CNC automatic multi-point inspection
Tilt function ± 30° tilt & 360° rotation for multi-angle inspection
Ljdpfx Asymfmzsa Iorh
Software & Features
✔ Automatic defect recognition: Y/N, crack, broken wire, offset, bridging, etc.
✔ CNC-controlled automatic inspection over multiple points.
✔ Infrared automatic navigation and positioning.
✔ Generation of inspection reports.
✔ Multi-angle & 360° rotation inspection for improved defect detection.
Bu ilan otomatik olarak tercüme edildiğinden bazı çeviri hataları oluşmuş olabilir.
Application: Micro-focus X-ray inspection of electronic components and assemblies such as BGA, CSP, SMT, wafer, SOP, QFN, sensors, and more.
X-ray Source
Specification Value
Type Sealed micro-focus X-ray tube
Voltage 40–90 kV
Current 10–200 µA
Max. output power 8 W
Microfocus spot size 15 µm
X-ray leakage ≤ 0.5–≤ 1 μSv/h (safety standard)
Detector & Image Quality
Specification Value
Detector type TFT industrial dynamic flat panel detector
Resolution pixel matrix 768 × 768 (occasionally 1.3 M pixel report depending on configuration)
Field of View (FOV) 65 × 65 mm to ~130 × 130 mm
Image resolution ~5.8 Lp/mm
Frame rate ~20–40 fps
A/D conversion 16 bits
🛠️ Mechanical & System Specifications
Property Value
Machine dimensions Approx. L850 × W1000 × H1700 mm
Max. sample/size ~280 × 320 mm
Net weight Approx. 750 kg
Power supply 220 V 10 A / 110 V 15 A 50–60 Hz
Operating system Industrial PC (Windows 7/10 64-bit)
Inspection mode CNC automatic multi-point inspection
Tilt function ± 30° tilt & 360° rotation for multi-angle inspection
Ljdpfx Asymfmzsa Iorh
Software & Features
✔ Automatic defect recognition: Y/N, crack, broken wire, offset, bridging, etc.
✔ CNC-controlled automatic inspection over multiple points.
✔ Infrared automatic navigation and positioning.
✔ Generation of inspection reports.
✔ Multi-angle & 360° rotation inspection for improved defect detection.
Bu ilan otomatik olarak tercüme edildiğinden bazı çeviri hataları oluşmuş olabilir.
Tedarikçi
Not: Ücretsiz kaydolun veya giriş yapın, tüm bilgilere erişmek için.
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